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Chapman Instruments offers non-contact surface roughness and thickness measurement systems. Applications include roughness, crack and edge chip detection for backgrind and after dicing. Non-contact wafer thickness systems are also available for thin applications, including bow, warp, taped wafer and bump wafer. All systems available with robotic handling, including 300mm and wafer flip. Also offered are general roughness and waviness on materials including Silicon, GaAs, Gold, SOI, Glass etc. Chapman also offers automated roughness measurements on the wafer edge. Both linear and circular geometry measurements are available, including robotic capability.For more information and specification, please contact us.