the Planarization technology up
to the atomic levels on the wafer surface - CMP (Chemical
Mechanical Polishing)TOHO Engineering as the subsidiary
of TOHOKOKI is specialized in CMP machine, CMP PAD,
CMP PAD Grooving and assembly of PAD Grooving machine.
TOHO Engineering provides the Total Service such as
CMP equipment, PAD, PAD grooving, PAD grooving machine
and measurement with simulation.TOHO engineering holds
the patent for CMP PAD grooving tools, and equipped
the clean room with full-scales to assemble the PAD
grooving machine. In collaboration with Prof. Doi of
Saitama University, CMP PAD patent (3497492) has acquired.
In partnership with Prof. Philipossian of the University
of Arizona, ARACA INC in USA has established, so TOHO
enables to supply the full CMP service. For more information
and specification, please contact us.