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Nuventys _ Laser Shock Cleaning
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2011/01/18 Á¶È¸ 58866

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Damage-free removal of sub-100 nm particles from photomasks or wafers is a challenge in the semiconductor industry. With the Nuventys Laser Shockwave Cleaning (LSC) technique particles are blasted away from the substrate surface by exposing them to a fast moving shockwave. Focusing a high-energy laser pulse in a process gas above the wafer or photomask produces the laser induced plasma shockwave. The rapid expansion of the process gas results in a fast moving shockwave that can remove sub-100 nm particles without damage. Laser Shockwave Cleaning (LSC) is an effective noncontact, chemical-free, dry, and selective nanoparticle removal technique.

 

VEGA¢ç Laser Shock Cleaning System

 

Overview:

The VEGA¢ç laser shock cleaning system provides yield enhancement by removing surface particles without the negative effects observed with traditional wet chemistry. This innovative system uses a high velocity shockwave to dislodge particles from the photomask surface. As the VEGA¢ç system does not use any chemicals, there is no surface roughing or etching, no water absorption, no chemical reaction and no chemical modification as seen with wet cleaning techniques.

 

Features:

    Laser shock cleaning (LSC)

    ISO class 1 minienvironment with temperature control

    Six-Axis robot with edge grip End-effector

    Fully automated Load/Unload (300mm FOUP, SMIF-200, RSP SMIF)

    Intuitive operator interface with user defined recipe¡¯s

    Defect map importing

    Spot, line, and full wafer or photomask cleaning.

    SEMI S2/S8 compliant

 

Benefits:

    Non contact chemical free cleaning of sub-100nm particles

    Effective cleaning of organic, inorganic and metallic particles

    Eliminate chemical consumption and disposal costs

    Eliminates particle redeposition from traditional cleaning techniques

   Laser shockwave is tunable for sensitive structures where chemicals and/or megasonic energy cannot be applied.

    Spot cleaning capabilities increases throughput and shorter process times