Damage-free removal of sub-100 nm particles from photomasks or wafers is a challenge in the semiconductor industry. With the Nuventys Laser Shockwave Cleaning (LSC) technique particles are blasted away from the substrate surface by exposing them to a fast moving shockwave. Focusing a high-energy laser pulse in a process gas above the wafer or photomask produces the laser induced plasma shockwave. The rapid expansion of the process gas results in a fast moving shockwave that can remove sub-100 nm particles without damage. Laser Shockwave Cleaning (LSC) is an effective noncontact, chemical-free, dry, and selective nanoparticle removal technique.

VEGA^® Laser Shock Cleaning System

Overview:

The VEGA^® laser shock cleaning system provides yield enhancement by removing surface particles without the negative effects observed with traditional wet chemistry. This innovative system uses a high velocity shockwave to dislodge particles from the photomask surface. As the VEGA^® system does not use any chemicals, there is no surface roughing or etching, no water absorption, no chemical reaction and no chemical modification as seen with wet cleaning techniques.

Features:

•    Laser shock cleaning (LSC)

•    ISO class 1 minienvironment with temperature control

•    Six-Axis robot with edge grip End-effector

•    Fully automated Load/Unload (300mm FOUP, SMIF-200, RSP SMIF)

•    Intuitive operator interface with user defined recipe’s

•    Defect map importing

•    Spot, line, and full wafer or photomask cleaning.

•    SEMI S2/S8 compliant

Benefits:

•    Non contact chemical free cleaning of sub-100nm particles

•    Effective cleaning of organic, inorganic and metallic particles

•    Eliminate chemical consumption and disposal costs

•    Eliminates particle redeposition from traditional cleaning techniques

•   Laser shockwave is tunable for sensitive structures where chemicals and/or megasonic energy cannot be applied.

•    Spot cleaning capabilities increases throughput and shorter process times