
Damage-free
removal of sub-100 nm particles from photomasks or wafers is a challenge in the
semiconductor industry. With the Nuventys Laser Shockwave
Cleaning (LSC) technique particles are blasted away from the substrate surface
by exposing them to a fast moving shockwave. Focusing a high-energy laser pulse
in a process gas above the wafer or photomask produces the laser induced plasma
shockwave. The rapid expansion of the process gas results in a fast moving
shockwave that can remove sub-100 nm
particles without damage. Laser Shockwave Cleaning (LSC) is an effective
noncontact, chemical-free, dry, and selective nanoparticle removal technique.
VEGA¢ç Laser Shock Cleaning
System
Overview:
The
VEGA¢ç laser shock cleaning system provides yield enhancement by removing surface particles
without the negative effects observed with traditional wet chemistry. This
innovative system uses a high velocity shockwave to dislodge particles from the
photomask surface. As the VEGA¢ç system does not use any chemicals,
there is no surface roughing or etching, no water absorption, no chemical
reaction and no chemical modification as seen with wet cleaning
techniques.
Features:
•
Laser shock cleaning
(LSC)
•
ISO class 1 minienvironment with temperature control
•
Six-Axis robot with edge grip
End-effector
•
Fully automated Load/Unload (300mm FOUP, SMIF-200, RSP
SMIF)
•
Intuitive operator interface with user defined
recipe¡¯s
•
Defect map
importing
•
Spot, line, and full wafer or photomask
cleaning.
•
SEMI S2/S8
compliant
Benefits:
•
Non contact chemical free cleaning of sub-100nm
particles
•
Effective cleaning of organic, inorganic and metallic
particles
•
Eliminate chemical consumption and disposal costs
•
Eliminates particle redeposition from traditional
cleaning techniques
• Laser shockwave is tunable for sensitive structures where chemicals
and/or megasonic energy cannot be applied.
•
Spot cleaning capabilities increases throughput and
shorter process times